贝格斯导热材料

Bergquist GapPad3500ULM柔软有基材间隙填充导热材料

材料生产商：美国贝格斯（BERGQUIST）公司研发产品

GapPad3500ULM GP3500ULM

GapPad350ULM可供规格：

厚度(Thickness)：0.51mm 1.02mm 1.52mm 2.03mm 2.54mm 3.18mm

片材(Sheet)：8”×16”（203×406 mm）

卷材(Roll)：无

导热系数(Thermal Conductivity)：3.5W/m-k

基材(Reinfrcement Carrier)：玻璃纤维(或无玻璃纤维)

胶面(Glue)：双面自带粘性

颜色(Color)：灰黑色

包装(Pack)：美国原装进口包装

抗击穿电压(Dielectic Breakdown Voltage)（Vac）:＞5000

持续使用温度（Continous Use Temp）：-60°~200°

GapPad350ULM应用材料特性：

GapPad3500ULM在非常低的压力下，低的S系列热阻，高的贴服性，S系列软度。针对低应力应用设计

玻纤增强，提高加工性能和搞斯裂性

Gap Pad® 3500ULM (ultra-low modulus) is an extremely soft gap filling material with a thermal conductivity of 3.5 W/m-K. The material offers exceptional thermal performance at low pressures due to

a unique 3.5 W/m-K filler package and ultra-low modulus resin formulation. The enhanced material is well suited for high performance applications requiring extremely low assembly stress.

Gap Pad® 3500ULM maintains a conformable nature that allows for excellent interfacing and wet-out

characteristics, even to surfaces with high roughness and/or topography. Gap Pad® 3500ULM is offered with and without fiberglass and has higher natural inherent tack on one side of the material, eliminating the need for thermallyimpeding adhesive layers. The top side has minimal tack for ease of handling. Gap Pad® 3500ULM is supplied with protective liners on both sides.

GapPad350ULM材料应用：

处理器，服务器S-RAMS,大容量存储驱动器，有线/无线通讯硬件，笔记本电脑，BGA封装，功率转换器

GapPad350ULM技术优势分析：

GapPad3500ULM导热界面材料系列以更好的贴服性，更高的导热性能及易于应用来满足电子工业对导热界面材料的日益增长的需要；在凹凸不平的表面，空气间隙和表面粗糙的散热器与电子元器件之间，广泛的GapPad3500ULM提供一个有效的导热界面。